Routing, punching, or v-groove scoring can bend the PCB panel, stressing components near the cutout lines. 2. ICT and Functional Testing
The most significant update, Revision A, was released in February 2012 and represents the current industry standard. Key improvements over the original version include: ipc-9704 pdf
You can obtain a copy of the IPC-9704 PDF guide from the IPC website or through other industry distributors. Routing, punching, or v-groove scoring can bend the
Application of Strain Measuring Technology in Board-Level Assembly Process Key improvements over the original version include: You
ε1,2=(εA+εB+εC)3±[(2εA−εB−εC)2+3(εB−εC)2]3epsilon sub 1 comma 2 end-sub equals the fraction with numerator open paren epsilon sub cap A plus epsilon sub cap B plus epsilon sub cap C close paren and denominator 3 end-fraction plus or minus the fraction with numerator the square root of open bracket open paren 2 epsilon sub cap A minus epsilon sub cap B minus epsilon sub cap C close paren squared plus 3 open paren epsilon sub cap B minus epsilon sub cap C close paren squared close bracket end-root and denominator 3 end-fraction 4 Steps of PCB Strain Gage Testing
A: Revision A adds lead-free assembly coverage, expanded measurement techniques, formulas for stress calculation, enhanced data analysis methods, and 22 full-color illustrations. It is the current recommended version.
) have much lower strain tolerances than smaller components.