This article provides a comprehensive overview of the IEC 60352-5:2020 standard, covering its scope, key technical requirements, test methods, and the significance of acquiring the official PDF. 1. What is IEC 60352-5?
The standard, titled "Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance," provides the definitive technical framework for evaluating press-fit technology in electronic assemblies. As of 2026, the current version is Edition 5.0 (2020) , which modernized the standard to include a broader range of board materials beyond traditional printed circuit boards (PCBs).
China’s GB 4706 series is largely identical to IEC 60335. However, a direct PDF labeled "IEC 603525" is likely a counterfeit or mis-labeled file. Avoid it.
Revised terminology to cover a wider range of board materials, including non-PCB substrates. iec 603525 pdf
: Enables rapid, highly repeatable robotic assembly using TE Connectivity Seating Machines or equivalent pneumatic systems.
It defines how a "press-in zone" (part of a connector terminal) is inserted into a plated through-hole (PTH) on a PCB. The deformation of the pin within the hole creates a high-pressure contact that is both electrically conductive and mechanically robust. Key Updates in the Latest Edition (2020)
IEC 60352 covers requirements for solderless connections used in electrical and electronic equipment. Part 5 (IEC 60352-5) focuses on specific types or classes of connections (see Section 3 for scope assumptions). The standard provides definitions, performance criteria, test procedures, and inspection methods intended to ensure reliable electrical and mechanical performance over the product lifetime. This article provides a comprehensive overview of the
is titled "Solderless connections – Part 5: Press-in connections – General requirements, test methods and practical guidance".
Compliant pins allow for component replacement without damaging the PCB.
edition reflects the move toward even smaller, higher-density interconnects required for modern 5G and data center infrastructure. iTeh Standards specific testing procedures required for these connectors, or are you looking for a summary of the changes in the latest 2020 edition? IEC 60352-5:2020 - iTeh Standards The standard, titled "Solderless connections - Part 5:
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The 2020 edition is the most recent, often referenced as BS EN IEC 60352-5:2020.